Tech **[EN] Global Top 30 Semiconductor Equipment Companies – Deep Dive & Usage Guide…
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**[EN] Global Top 30 Semiconductor Equipment Companies – Deep Dive & Usage Guide**
**[KO] 전세계 반도체 장비 기업 30선 – 심층 정리와 활용 가이드**
---
## 1. 개요 / Overview
There is no single official “top 30” list that everyone agrees on. Different reports rank companies slightly differently depending on:
* which equipment is included (only wafer-fab equipment vs. also test, packaging, subsystems),
* time period (2023 vs. 2024 sales),
* whether Chinese newcomers and back-end (패키징·테스트) vendors are counted.
Below is a **representative, revenue-weighted view around 2023–2024**, built from industry studies that consistently show the same big names at the top. ([IBS Electronics][1])
* Ranks **1–10** are relatively robust across market reports.
* Ranks **11–30** are grouped by scale and technological importance; exact ordering can vary by segment, but all are major global players.
---
## 2. Approximate Global Top-30 Semiconductor Equipment Vendors (2023–24)
**Table 1 – Major semiconductor equipment suppliers (front-end + test + packaging)**
| Rank* | Company | HQ Country / Region | Main Segment(s) |
| ----- | ---------------------------------------------------- | ------------------- | ----------------------------------------------------------- |
| 1 | **ASML** | Netherlands | Lithography (EUV & DUV) |
| 2 | **Applied Materials** | USA | Deposition, etch, CMP, implantation, patterning, packaging |
| 3 | **Lam Research** | USA | Etch, deposition, clean |
| 4 | **Tokyo Electron (TEL)** | Japan | Etch, deposition, coater/developer, clean |
| 5 | **KLA** | USA | Metrology & inspection |
| 6 | **Naura Technology (North Huachuang)** | China | Etch, deposition, clean; largest Chinese equipment maker |
| 7 | **SCREEN Semiconductor Solutions (SCREEN Holdings)** | Japan | Wet clean, coater/developer, track systems |
| 8 | **ASM International (ASMI)** | Netherlands | ALD, epitaxy, thin-film deposition |
| 9 | **Advantest** | Japan | Semiconductor test (ATE, memory/logic test) |
| 10 | **Teradyne** | USA | Automated test equipment (SoC, memory, SLT) |
| 11 | **ASMPT** | Hong Kong/Singapore | Packaging & assembly, SMT, wire/die bonders |
| 12 | **DISCO** | Japan | Dicing saws, grinding, thinning |
| 13 | **Tokyo Seimitsu (ACCRETECH)** | Japan | Probers, dicing, metrology |
| 14 | **Hitachi High-Tech** | Japan | CD-SEM, inspection, etch |
| 15 | **Canon** | Japan | Lithography (DUV, i-line) & nanoimprint |
| 16 | **Nikon** | Japan | Lithography steppers & scanners |
| 17 | **Hanmi Semiconductor** | South Korea | Memory packaging, HBM/HBM4 equipment, handlers |
| 18 | **BESI (BE Semiconductor Industries)** | Netherlands | Advanced packaging, hybrid bonding tools |
| 19 | **Kulicke & Soffa (K&S)** | Singapore/USA | Wire/die bonders, advanced packaging solutions |
| 20 | **Onto Innovation** | USA | Metrology, inspection, packaging inspection & software |
| 21 | **Cohu** | USA | Test handlers, ATE for RF/SoC, MEMS |
| 22 | **EV Group (EVG)** | Austria | Wafer bonding, lithography, NIL |
| 23 | **SUSS MicroTec** | Germany | Back-end lithography, wafer bonding, photomask processing |
| 24 | **SEMES (Samsung subsidiary)** | South Korea | Cleaning, etch, photo-track, back-end tools |
| 25 | **AMEC (Advanced Micro-Fabrication Equipment)** | China | Etch & deposition, especially for logic and memory |
| 26 | **Oxford Instruments Plasma Technology** | UK | Etch & deposition systems, ALD, RIE/ICP platforms |
| 27 | **Plasma-Therm** | USA | Etch, deposition, plasma dicing, specialty devices |
| 28 | **MKS Instruments** | USA | Process subsystems, vacuum, RF power, inspection components |
| 29 | **SMEE (Shanghai Micro Electronics Equipment)** | China | Lithography (DUV steppers) |
| 30 | **FormFactor** | USA | Probe cards & wafer-level test hardware |
*Rank is **approximate beyond the top 5–10** and is meant to show scale and importance, not a precise official ordering.
---
## 3. Company-by-Company Highlights (English)
### Tier 1: Core wafer-fab equipment giants (1–5)
1. **ASML (Netherlands)** –
* **Absolute monopoly in EUV lithography** and dominant in leading-edge DUV scanners for advanced logic and memory. ([Scribd][2])
* Every cutting-edge fab (TSMC, Samsung, Intel, etc.) depends on ASML’s EUV tools; High-NA EUV will further lock in its position.
* Business model is high ASPs, huge service contracts, and long lead times.
2. **Applied Materials (USA)** –
* Broadest portfolio across **deposition, etch, CMP, ion implantation, inspection, and now advanced packaging**. ([The Business Research Company][3])
* Recently pushing into **hybrid bonding & angstrom-era patterning** (Kinex, Xtera, PROVision 10).
3. **Lam Research (USA)** –
* Etch and deposition specialist, especially **plasma etch and tungsten/oxide deposition**. ([Infinity Market Research][4])
* Strong position in 3D NAND, DRAM and logic GAA transistor processes.
4. **Tokyo Electron – TEL (Japan)** –
* Full suite of **etch, deposition, coater/developer, clean** equipment. ([BCC Research][5])
* Critical in photoresist coating/development and patterning tracks, alongside SCREEN.
5. **KLA (USA)** –
* Global leader in **metrology & inspection**: defect inspection, overlay, CD measurement. ([Gii Korea][6])
* Essential for yield ramp and process control at every node.
---
### Tier 2: Large diversified specialists (6–10)
6. **Naura Technology / North Huachuang (China)** –
* China’s largest equipment maker; CINNO Research reports it as **6th globally by 2024 semi-equipment sales**, focusing on etch, PVD/CVD, and cleaning. ([위키백과][7])
* Key for China’s “equipment localization” push.
7. **SCREEN Semiconductor Solutions (Japan)** –
* World-leading **wet cleaning and coater/developer** systems; major co-development partner with imec and others. ([screen.co.jp][8])
8. **ASM International (Netherlands)** –
* Pioneer in **ALD (Atomic Layer Deposition)** and epitaxy tools, crucial for logic GAA and advanced DRAM. ([Scribd][2])
9. **Advantest (Japan)** –
* Top global supplier of **test equipment**, rated #1 in assembly/test equipment and a top chip-equipment supplier in repeated TechInsights surveys. ([株式会社アドバンテスト][9])
* Benefiting strongly from **AI and HBM-related test demand**.
10. **Teradyne (USA)** –
* Co-leader with Advantest in **ATE**, especially SoC and RF. ([Teradyne][10])
* Also expanding into **system-level test (SLT)** and industrial robotics.
---
### Tier 3: Back-end & packaging powerhouses (11–20)
11. **ASMPT (Hong Kong/Singapore)** –
* Global leader in **advanced packaging & SMT**, including wire bonding, die bonding, and SMT placement. ([asmpt.com][11])
12. **DISCO (Japan)** –
* Dominant in **wafer dicing saws and grinding systems**, critical for 3D stacking, SiC/GaN, and thinning processes. ([disco.co.jp][12])
13. **Tokyo Seimitsu / ACCRETECH (Japan)** –
* Provides **wafer probers, dicing, metrology and CMP systems** for both logic and memory customers. ([東京精密][13])
14. **Hitachi High-Tech (Japan)** –
* Major supplier of **CD-SEM, defect inspection and etch** tools, especially for EUV mask and pattern monitoring. ([hitachi-hightech.com][14])
15. **Canon (Japan)** –
* Focused on **mature-node lithography** and **nanoimprint lithography (NIL)**; important for IoT, CIS, displays and some advanced patterning niches. ([Gii Korea][6])
16. **Nikon (Japan)** –
* Long-time lithography player with tools used in **mature node logic, analog and memory production**, still significant in specific fabs. ([Gii Korea][6])
17. **Hanmi Semiconductor (South Korea)** –
* Selected as the **only Korean firm in TechInsights’ global “Top 10 Semiconductor Equipment Companies”** (customer satisfaction survey). ([hanmisemi.com][15])
* Strong in **HBM/advanced memory packaging, hybrid bonding-related equipment and handlers**; tightly linked to Samsung and SK hynix roadmaps.
18. **BESI – BE Semiconductor Industries (Netherlands)** –
* Advanced packaging specialist; **hybrid bonding tools** for 3D logic and HBM4 are considered industry-leading. ([Besi][16])
19. **Kulicke & Soffa (K&S, Singapore/USA)** –
* Historic leader in **wire bonding**; now expanding into **advanced packaging, hybrid bonding and system-in-package (SiP)**. ([KNS][17])
20. **Onto Innovation (USA)** –
* Provides **inspection, metrology, and packaging inspection systems**, plus yield-enhancing software; important in **advanced packaging & 3D integration**. ([OntoInnovation][18])
---
### Tier 4: Key niche & specialty equipment suppliers (21–30)
21. **Cohu (USA)** –
* 50+ years of expertise in **test handlers** and ATE, targeting SoC, RF, MEMS, and power devices. ([Cohu][19])
22. **EV Group – EVG (Austria)** –
* Leading provider of **wafer bonding, thin-wafer processing, and NIL lithography**; central to 3D-IC and heterogeneous integration flows. ([EV Group][20])
23. **SUSS MicroTec (Germany)** –
* Supplies equipment for **backend lithography, wafer bonding and photomask processing**, with strong presence in Europe, US, and Asia. ([SUSS][21])
24. **SEMES (South Korea)** –
* Samsung’s equipment arm; **Korea’s largest equipment manufacturer**, focusing on cleaning, photo-track, etch, and some back-end equipment. ([Semes][22])
25. **AMEC (China)** –
* Advanced etch and deposition vendor; cited as a key player in boosting China’s deposition market share alongside Naura. ([Infinity Market Research][4])
26. **Oxford Instruments Plasma Technology (UK)** –
* Provides **etch & deposition tools (RIE, ICP, ALD)** for compound semiconductors, RF, power devices, and R&D. ([Oxford Instruments][23])
27. **Plasma-Therm (USA)** –
* Specializes in **plasma etch, deposition, and plasma dicing** for specialty semiconductor and advanced packaging markets. ([Plasma-Therm][24])
28. **MKS Instruments (USA)** –
* Supplies **vacuum, RF power, gas delivery, optics and process control subsystems** for many front-end tools; crucial “sub-equipment” vendor. ([MKS][25])
29. **SMEE – Shanghai Micro Electronics Equipment (China)** –
* China’s main **lithography tool** producer (mature-node DUV steppers); strategically important for domestic fabs given export controls on ASML/US tools. ([Gii Korea][6])
30. **FormFactor (USA)** –
* World-class provider of **probe cards and wafer-level test hardware**, essential for DRAM, HBM, and advanced logic test. ([FormFactor, Inc.][26])
---
## 4. How the Equipment Market is Structured (English)
To understand these rankings, it helps to see the **major process segments**:
1. **Lithography (Patterning)**
* Core vendors: **ASML, Canon, Nikon, SMEE**, plus **EVG/SUSS** for NIL and back-end lithography. ([Gii Korea][6])
* EUV & High-NA: Only ASML at the leading edge.
2. **Etch & Deposition**
* Core vendors: **Applied Materials, Lam, TEL, Naura, AMEC, Oxford, Plasma-Therm, SEMES, ASM International**. ([Infinity Market Research][4])
* Critical for **GAA transistors, 3D NAND, power devices (SiC/GaN)**.
3. **Metrology & Inspection**
* Core vendors: **KLA, Hitachi High-Tech, SCREEN (some tools), Onto Innovation, ASML (actinic mask inspection), MKS (subsystems)**. ([Valuates Reports][27])
4. **Cleaning & Coater/Developer (Track)**
* Core vendors: **SCREEN, TEL, SEMES, Applied Materials**, etc. ([screen.co.jp][8])
5. **Test (ATE) & Handlers**
* Core vendors: **Advantest, Teradyne, Cohu, FormFactor**. ([株式会社アドバンテスト][9])
6. **Packaging & Advanced Packaging**
* Core vendors: **ASMPT, BESI, K&S, Hanmi, EVG, SUSS, Onto, Plasma-Therm, SEMES**. ([asmpt.com][11])
---
## 5. Practical Tips & “Applications” of this Ranking (English)
1. **For investment / strategy analysis**
* **Tier-1 (1–5)**: highly concentrated WFE core; cyclical but with strong long-term growth from AI, 2 nm and below, and HBM.
* **Tier-2 and Chinese vendors (6, 25, 29)**: fastest growth due to **localization and geopolitics**; Naura and AMEC are central to China’s etch/deposition roadmap. ([위키백과][7])
* **Packaging boom (11, 17–19, 22–23)**: driven by **chiplets, 2.5D/3D, HBM3/4** and AI data center demand. BESI, ASMPT, K&S, Hanmi, EVG and SUSS all sit in this trend. ([Harvard Business School][28])
2. **For technology tracking or R&D**
* To follow **EUV / High-NA**: watch **ASML, KLA, Hitachi High-Tech** and imec collaborations. ([hitachihyoron.com][29])
* For **hybrid bonding & HBM4 packaging**: **BESI, ASMPT, Hanmi, EVG, SUSS, Onto** plus Applied’s Kinex platform. ([Besi][16])
3. **For supply-chain / risk management**
* Many fabs depend on **single-source tools** (e.g., ASML EUV, BESI hybrid bonding, certain DISCO grinders), so any disruption directly impacts capacity. ([newsletter.semianalysis.com][30])
* **Subsystem vendors** like MKS and Oxford Instruments are hidden single-points-of-failure in vacuum, RF power, and etch subsystems. ([MKS][25])
4. **For content creation / education**
* You can map each **fab step** (lithography → etch → deposition → clean → metrology → test → packaging) to specific companies in the table and explain “who does what” in a chip factory, which is a good way to teach the semiconductor value chain in videos or articles.
---
## 6. 한국어 설명 (요약 + 활용)
### 6-1. 전세계 반도체 장비 시장 구조
* **1군(ASML, Applied, Lam, TEL, KLA)**
* 웨이퍼 전공정(WFE)의 핵심 5개사로, **노광(EUV/DUV), 식각, 증착, CMP, 검사·계측**을 사실상 과점하고 있습니다. ([IBS Electronics][1])
* **2군(Screen, ASM, Naura, Advantest, Teradyne 등)**
* 특정 공정(클리닝·코터/디벨로퍼, ALD, 테스트, 중국 국산화 장비 등)에 특화된 강자들입니다.
* **3군·4군(ASMPT, Hanmi, BESI, K&S, EVG, SUSS, SEMES, AMEC, Oxford, Plasma-Therm, MKS 등)**
* **패키징·HBM·칩렛·3D 적층, 시험·핸들러, 특수 공정(플라즈마, 복합반도체, 파워반도체)** 영역을 담당하는 회사들입니다.
### 6-2. 한국 관점에서 눈여겨볼 포인트
1. **국산 장비와의 연결고리**
* **Hanmi Semiconductor**는 TechInsights의 ‘세계 Top 10 반도체 장비사’ 고객만족도 조사에 유일하게 포함된 한국 업체로, **HBM·하이브리드 본딩·메모리 패키징**에서 글로벌 고객을 확보하고 있습니다. ([hanmisemi.com][15])
* **SEMES**는 삼성전자 장비 자회사로, 세정·포토트랙·에치 등에서 **국산화·내부 공급**을 담당하며 한국 생태계 안정성에 결정적입니다. ([Semes][22])
2. **중국 장비의 부상과 위험**
* **Naura, AMEC, SMEE**는 중국의 국산 장비 대표 기업으로, 에치·증착·노광 영역에서 점유율을 빠르게 키우고 있습니다. ([위키백과][7])
* 미국·네덜란드의 수출 규제로 인해 **첨단(5 nm 이하)에서는 여전히 ASML·미국 업체 의존**이 크지만, **성숙 공정·파워반도체·디스플레이** 쪽에서는 중국 장비의 존재감이 커지고 있습니다.
3. **AI·HBM 시대의 장비 포인트**
* AI 서버용 HBM3/4 및 2.5D·3D 패키징 수요로 인해
* **BESI, ASMPT, Hanmi, K&S, EVG, SUSS, Onto, Plasma-Therm** 등 패키징·본딩·백엔드 장비사는 장기 성장 스토리를 가지고 있습니다. ([Reuters][31])
* 전공정 측면에서는 **ASML(EUV, High-NA), Applied/Lam/TEL(식각·증착), KLA/Hitachi High-Tech(계측)**의 중요성이 더 커지고 있습니다.
4. **활용 아이디어 (콘텐츠·비즈니스)**
* 이 30개사를 **공정 단계별로 재정렬**하여 “한 칩이 만들어지는 여정”을 영상/글로 풀면, 반도체 입문자에게 매우 직관적인 설명이 됩니다.
* 투자·사업 관점에서는
* 사이클 상단/하단에 따라 **전공정 vs 후공정**의 실적 민감도가 다르고,
* **장비 국산화·수출 규제·AI 수요**라는 세 축이 각 회사에 어떤 영향을 주는지를 정리하면, 전략 분석 자료로도 쓸 수 있습니다.
---
## 7. 日本語による要約説明
### 7-1. 市場構造
* **トップ5 (ASML, Applied, Lam, TEL, KLA)** は
**リソグラフィ・エッチング・成膜・CMP・計測/検査** をほぼ寡占している「フロントエンド中核企業」です。 ([IBS Electronics][1])
* **Naura / AMEC / SMEE** などの中国系企業は、成熟ノードやパワーデバイス向けで急速にシェアを拡大しています。 ([위키백과][7])
* **Advantest / Teradyne / Cohu / FormFactor** はテスト・ハンドラ分野、
**ASMPT / BESI / K&S / Hanmi / EVG / SUSS** は先端パッケージング・HBM・3D実装分野のキープレーヤーです. ([株式会社アドバンテスト][9])
### 7-2. 技術トレンド
* **EUV / High-NA**：ASML と KLA・Hitachi High-Tech などの計測が必須。
* **HBM・3Dパッケージング**：BESI, ASMPT, Hanmi, K&S, EVG, SUSS, Onto などがハイブリッドボンディングやファンアウト技術で重要。 ([Reuters][31])
### 7-3. 活用のヒント
* 半導体教育では、この30社を **「リソグラフィ → エッチング → 成膜 → 洗浄・トラック → 計測 → テスト → パッケージング」** に並べ替え、「どの工程を誰が担当しているか」を示すと理解しやすくなります。
* サプライチェーン分析では、**ASML EUV や BESI ハイブリッドボンダ、DISCO ダイサなどの“単一供給”装置**がリスク要因になります。 ([Scribd][2])
---
## 8. 中文（简体）说明与应用
### 8-1. 产业结构简要说明
* **前端核心五巨头**：ASML、应用材料（Applied Materials）、Lam Research、东京电子（TEL）、KLA，主导了全球光刻、刻蚀、沉积、CMP 以及计量检测等关键设备市场。 ([IBS Electronics][1])
* **中国本土厂商**：
* **北方华创（Naura）** 已被研究机构评为全球第六大设备公司，在刻蚀、PVD/CVD、清洗方面快速追赶国际厂商。 ([위키백과][7])
* **AMEC、SMEE** 分别在刻蚀/沉积和光刻领域承担“国产替代”的角色。 ([Infinity Market Research][4])
* **封装与测试**：
* ASMPT、BESI、韩美半导体、K&S、EVG、SUSS、Onto Innovation、Cohu、FormFactor 等公司集中在 **先进封装、HBM、3D 封装、探针卡、Handler** 等后端领域。 ([asmpt.com][11])
### 8-2. AI / HBM 浪潮下的关注点
* **AI 训练+推理服务器** 带动 HBM3/4、Chiplet 和 2.5D/3D 封装需求：
* 上游前端受益：ASML（EUV）、Applied / Lam / TEL（刻蚀与沉积）、KLA / Hitachi High-Tech（计量与检测）等。 ([Scribd][2])
* 后端受益：BESI（混合集成键合）、ASMPT、韩美半导体、K&S、EVG、SUSS 等。 ([Besi][16])
### 8-3. 实际应用建议
* 做行业研究或写文章时，可以把这 30 家公司按 **工艺环节** 分成表格，对应到晶圆厂的每一道工序，这样读者能清楚看到“光刻机是谁的、刻蚀机是谁的、封装设备是谁的”。
* 风险管理层面，需要识别 **单一供应商设备**（如 ASML EUV、BESI 混合键合工具、DISCO 切割研磨设备等）对产能的影响。 ([Scribd][2])
---
## 9. 간단 용어 대조표 (EN / KO / JP / ZH)
| English | 한국어 | 日本語 | 中文(简体) |
| ------------------------------ | --------- | ----------- | ------ |
| Lithography | 노광, 리소그래피 | リソグラフィ | 光刻 |
| Etch | 식각 | エッチング | 刻蚀 |
| Deposition (CVD/PVD/ALD) | 증착 | 成膜 | 沉积 |
| Metrology & inspection | 계측·검사 | 計測・検査 | 计量与检测 |
| Front-end (WFE) | 전공정 | 前工程 | 前端工艺 |
| Back-end / packaging | 후공정·패키징 | 後工程・パッケージング | 后端/封装 |
| ATE (Automated Test Equipment) | 자동 테스트 장비 | 自動テスト装置 | 自动测试设备 |
---
### 마지막 한 줄 정리
* 상위 30개 반도체 장비사는 **노광·식각·증착·세정·계측·테스트·패키징** 전체 체인을 거의 다 장악하고 있으며,
* **ASML·Applied·Lam·TEL·KLA(전공정)**, **Naura/AMEC/SMEE(중국)**,
**ASMPT·BESI·Hanmi·K&S·EVG·SUSS(패키징)**,
**Advantest·Teradyne·Cohu·FormFactor(테스트)**
이라는 축으로 보면 전체 지형이 가장 잘 보입니다.
- [Reuters](https://www.reuters.com/markets/deals/applied-materials-buys-9-stake-advanced-packaging-firm-besi-2025-04-15/?utm_source=chatgpt.com)
- [Reuters](https://www.reuters.com/technology/advantest-raises-full-year-operating-profit-forecast-by-24-strong-ai-demand-2025-07-29/?utm_source=chatgpt.com)
- [Investopedia](https://www.investopedia.com/teradyne-stock-leads-s-and-p-500-gainers-after-better-than-expected-results-11781740?utm_source=chatgpt.com)
- [Times Union](https://www.timesunion.com/business/article/ualbany-chip-production-line-albany-nanotech-gets-20051426.php?utm_source=chatgpt.com)
[1]: https://www.ibselectronics.com/resources/news/top-10-semiconductor-equipment-manufacturers-in-the-world-in-terms-of-market-size-in-2024/ "Top 10 Semiconductor Equipment Manufacturers in the World in Terms of Market Size in 2024 | IBS Electronics"
[2]: https://www.scribd.com/document/901625793/Allianz-Trade-Semiconductors-Report-2025-En?utm_source=chatgpt.com "Allianz Trade Semiconductors Report 2025 en | PDF"
[3]: https://www.thebusinessresearchcompany.com/report/semiconductor-capital-equipment-global-market-report?utm_source=chatgpt.com "Semiconductor Capital Equipment Market Size Report 2025"
[4]: https://infinitymarketresearch.com/report/semiconductor-processing-equipment-market/38509?utm_source=chatgpt.com "Global Semiconductor Processing Equipment Market ..."
[5]: https://www.bccresearch.com/market-research/manufacturing/semiconductor-machinery-manufacturing-global-markets.html?srsltid=AfmBOopExv1TwSQ9_5pIvwJi57C6seupHhbsLZWVZz9A6KALNuPLs883&utm_source=chatgpt.com "Semiconductor Machinery Manufacturing: Global Markets"
[6]: https://www.giikorea.co.kr/report/qyr1693165-semiconductor-manufacturing-equipment-global.html?utm_source=chatgpt.com "시장 점유율과 순위, 전체 매출 및 수요 예측(2025-2031년)"
[7]: https://en.wikipedia.org/wiki/Naura_Technology?utm_source=chatgpt.com "Naura Technology"
[8]: https://www.screen.co.jp/spe/en/products?utm_source=chatgpt.com "Products | SCREEN Semiconductor Solutions Co., Ltd."
[9]: https://www.advantest.com/en/news/2025/20250522.html?utm_source=chatgpt.com "Advantest Ranks Global #1 in Assembly Test Equipment ..."
[10]: https://www.teradyne.com/automated-test-equipment/?utm_source=chatgpt.com "Automated Test Equipment"
[11]: https://www.asmpt.com/?utm_source=chatgpt.com "ASMPT - Enabling the digital world"
[12]: https://www.disco.co.jp/eg/products/?utm_source=chatgpt.com "Product Information"
[13]: https://www.accretech.com/en/product/semicon/semi/index.html?utm_source=chatgpt.com "Semiconductor Manufacturing Equipment"
[14]: https://www.hitachi-hightech.com/global/en/products/semiconductor-manufacturing/?utm_source=chatgpt.com "Semiconductor Manufacturing Equipment"
[15]: https://www.hanmisemi.com/index.php?CurrentPage=4&action=SiteBoardCn&iBrdContNo=11&iBrdNo=5&module=Board&sBrdContRe=0&sMode=VIEW_FORM&sSearchField=&sSearchValue=&utm_source=chatgpt.com "HANMI Semiconductor"
[16]: https://www.besi.com/products-technology/productgroup/hybrid-bonding/?utm_source=chatgpt.com "Hybrid Bonding"
[17]: https://www.kns.com/?utm_source=chatgpt.com "K&S - Leading Provider of Interconnect Solutions"
[18]: https://ontoinnovation.com/product-categories/metrology/?utm_source=chatgpt.com "Semiconductor Metrology Products"
[19]: https://www.cohu.com/test-handlers/?utm_source=chatgpt.com "Test Handlers"
[20]: https://www.evgroup.com/products/bonding?utm_source=chatgpt.com "Bonding"
[21]: https://www.suss.com/en?utm_source=chatgpt.com "SUSS Semiconductor Equipment Manufacturer"
[22]: https://semes.com/en/company/corporate-overview?utm_source=chatgpt.com "SEMES"
[23]: https://www.oxinst.com/products/deposition-and-etch-tools/?utm_source=chatgpt.com "Deposition & Etch Tools"
[24]: https://www.plasmatherm.com/?utm_source=chatgpt.com "Plasma-Therm Main"
[25]: https://www.mks.com/?utm_source=chatgpt.com "MKS Instruments"
[26]: https://www.formfactor.com/products/probe-cards/?utm_source=chatgpt.com "Probe Cards - Design and Manufacturing"
[27]: https://reports.valuates.com/market-reports/QYRE-Auto-17M2831/covid-19-impact-on-semiconductor-manufacturing-equipment?utm_source=chatgpt.com "Semiconductor Manufacturing Equipment Market Size"
[28]: https://www.hbs.edu/faculty/Pages/item.aspx?num=67656&utm_source=chatgpt.com "The Rise of Advanced Packaging: Kulicke & Soffa's ..."
[29]: https://www.hitachihyoron.com/rev/archive/2023/r2023_02/pdf/2023_02_11.pdf?utm_source=chatgpt.com "Semiconductor Device Manufacturing & Inspection Equipment"
[30]: https://newsletter.semianalysis.com/p/disco-corporation-the-world-leader?utm_source=chatgpt.com "DISCO Corporation, The World Leader In Semiconductor ..."
[31]: https://www.reuters.com/markets/deals/applied-materials-buys-9-stake-advanced-packaging-firm-besi-2025-04-15/?utm_source=chatgpt.com "Applied Materials becomes largest shareholder of advanced packaging firm BESI"
**[KO] 전세계 반도체 장비 기업 30선 – 심층 정리와 활용 가이드**
---
## 1. 개요 / Overview
There is no single official “top 30” list that everyone agrees on. Different reports rank companies slightly differently depending on:
* which equipment is included (only wafer-fab equipment vs. also test, packaging, subsystems),
* time period (2023 vs. 2024 sales),
* whether Chinese newcomers and back-end (패키징·테스트) vendors are counted.
Below is a **representative, revenue-weighted view around 2023–2024**, built from industry studies that consistently show the same big names at the top. ([IBS Electronics][1])
* Ranks **1–10** are relatively robust across market reports.
* Ranks **11–30** are grouped by scale and technological importance; exact ordering can vary by segment, but all are major global players.
---
## 2. Approximate Global Top-30 Semiconductor Equipment Vendors (2023–24)
**Table 1 – Major semiconductor equipment suppliers (front-end + test + packaging)**
| Rank* | Company | HQ Country / Region | Main Segment(s) |
| ----- | ---------------------------------------------------- | ------------------- | ----------------------------------------------------------- |
| 1 | **ASML** | Netherlands | Lithography (EUV & DUV) |
| 2 | **Applied Materials** | USA | Deposition, etch, CMP, implantation, patterning, packaging |
| 3 | **Lam Research** | USA | Etch, deposition, clean |
| 4 | **Tokyo Electron (TEL)** | Japan | Etch, deposition, coater/developer, clean |
| 5 | **KLA** | USA | Metrology & inspection |
| 6 | **Naura Technology (North Huachuang)** | China | Etch, deposition, clean; largest Chinese equipment maker |
| 7 | **SCREEN Semiconductor Solutions (SCREEN Holdings)** | Japan | Wet clean, coater/developer, track systems |
| 8 | **ASM International (ASMI)** | Netherlands | ALD, epitaxy, thin-film deposition |
| 9 | **Advantest** | Japan | Semiconductor test (ATE, memory/logic test) |
| 10 | **Teradyne** | USA | Automated test equipment (SoC, memory, SLT) |
| 11 | **ASMPT** | Hong Kong/Singapore | Packaging & assembly, SMT, wire/die bonders |
| 12 | **DISCO** | Japan | Dicing saws, grinding, thinning |
| 13 | **Tokyo Seimitsu (ACCRETECH)** | Japan | Probers, dicing, metrology |
| 14 | **Hitachi High-Tech** | Japan | CD-SEM, inspection, etch |
| 15 | **Canon** | Japan | Lithography (DUV, i-line) & nanoimprint |
| 16 | **Nikon** | Japan | Lithography steppers & scanners |
| 17 | **Hanmi Semiconductor** | South Korea | Memory packaging, HBM/HBM4 equipment, handlers |
| 18 | **BESI (BE Semiconductor Industries)** | Netherlands | Advanced packaging, hybrid bonding tools |
| 19 | **Kulicke & Soffa (K&S)** | Singapore/USA | Wire/die bonders, advanced packaging solutions |
| 20 | **Onto Innovation** | USA | Metrology, inspection, packaging inspection & software |
| 21 | **Cohu** | USA | Test handlers, ATE for RF/SoC, MEMS |
| 22 | **EV Group (EVG)** | Austria | Wafer bonding, lithography, NIL |
| 23 | **SUSS MicroTec** | Germany | Back-end lithography, wafer bonding, photomask processing |
| 24 | **SEMES (Samsung subsidiary)** | South Korea | Cleaning, etch, photo-track, back-end tools |
| 25 | **AMEC (Advanced Micro-Fabrication Equipment)** | China | Etch & deposition, especially for logic and memory |
| 26 | **Oxford Instruments Plasma Technology** | UK | Etch & deposition systems, ALD, RIE/ICP platforms |
| 27 | **Plasma-Therm** | USA | Etch, deposition, plasma dicing, specialty devices |
| 28 | **MKS Instruments** | USA | Process subsystems, vacuum, RF power, inspection components |
| 29 | **SMEE (Shanghai Micro Electronics Equipment)** | China | Lithography (DUV steppers) |
| 30 | **FormFactor** | USA | Probe cards & wafer-level test hardware |
*Rank is **approximate beyond the top 5–10** and is meant to show scale and importance, not a precise official ordering.
---
## 3. Company-by-Company Highlights (English)
### Tier 1: Core wafer-fab equipment giants (1–5)
1. **ASML (Netherlands)** –
* **Absolute monopoly in EUV lithography** and dominant in leading-edge DUV scanners for advanced logic and memory. ([Scribd][2])
* Every cutting-edge fab (TSMC, Samsung, Intel, etc.) depends on ASML’s EUV tools; High-NA EUV will further lock in its position.
* Business model is high ASPs, huge service contracts, and long lead times.
2. **Applied Materials (USA)** –
* Broadest portfolio across **deposition, etch, CMP, ion implantation, inspection, and now advanced packaging**. ([The Business Research Company][3])
* Recently pushing into **hybrid bonding & angstrom-era patterning** (Kinex, Xtera, PROVision 10).
3. **Lam Research (USA)** –
* Etch and deposition specialist, especially **plasma etch and tungsten/oxide deposition**. ([Infinity Market Research][4])
* Strong position in 3D NAND, DRAM and logic GAA transistor processes.
4. **Tokyo Electron – TEL (Japan)** –
* Full suite of **etch, deposition, coater/developer, clean** equipment. ([BCC Research][5])
* Critical in photoresist coating/development and patterning tracks, alongside SCREEN.
5. **KLA (USA)** –
* Global leader in **metrology & inspection**: defect inspection, overlay, CD measurement. ([Gii Korea][6])
* Essential for yield ramp and process control at every node.
---
### Tier 2: Large diversified specialists (6–10)
6. **Naura Technology / North Huachuang (China)** –
* China’s largest equipment maker; CINNO Research reports it as **6th globally by 2024 semi-equipment sales**, focusing on etch, PVD/CVD, and cleaning. ([위키백과][7])
* Key for China’s “equipment localization” push.
7. **SCREEN Semiconductor Solutions (Japan)** –
* World-leading **wet cleaning and coater/developer** systems; major co-development partner with imec and others. ([screen.co.jp][8])
8. **ASM International (Netherlands)** –
* Pioneer in **ALD (Atomic Layer Deposition)** and epitaxy tools, crucial for logic GAA and advanced DRAM. ([Scribd][2])
9. **Advantest (Japan)** –
* Top global supplier of **test equipment**, rated #1 in assembly/test equipment and a top chip-equipment supplier in repeated TechInsights surveys. ([株式会社アドバンテスト][9])
* Benefiting strongly from **AI and HBM-related test demand**.
10. **Teradyne (USA)** –
* Co-leader with Advantest in **ATE**, especially SoC and RF. ([Teradyne][10])
* Also expanding into **system-level test (SLT)** and industrial robotics.
---
### Tier 3: Back-end & packaging powerhouses (11–20)
11. **ASMPT (Hong Kong/Singapore)** –
* Global leader in **advanced packaging & SMT**, including wire bonding, die bonding, and SMT placement. ([asmpt.com][11])
12. **DISCO (Japan)** –
* Dominant in **wafer dicing saws and grinding systems**, critical for 3D stacking, SiC/GaN, and thinning processes. ([disco.co.jp][12])
13. **Tokyo Seimitsu / ACCRETECH (Japan)** –
* Provides **wafer probers, dicing, metrology and CMP systems** for both logic and memory customers. ([東京精密][13])
14. **Hitachi High-Tech (Japan)** –
* Major supplier of **CD-SEM, defect inspection and etch** tools, especially for EUV mask and pattern monitoring. ([hitachi-hightech.com][14])
15. **Canon (Japan)** –
* Focused on **mature-node lithography** and **nanoimprint lithography (NIL)**; important for IoT, CIS, displays and some advanced patterning niches. ([Gii Korea][6])
16. **Nikon (Japan)** –
* Long-time lithography player with tools used in **mature node logic, analog and memory production**, still significant in specific fabs. ([Gii Korea][6])
17. **Hanmi Semiconductor (South Korea)** –
* Selected as the **only Korean firm in TechInsights’ global “Top 10 Semiconductor Equipment Companies”** (customer satisfaction survey). ([hanmisemi.com][15])
* Strong in **HBM/advanced memory packaging, hybrid bonding-related equipment and handlers**; tightly linked to Samsung and SK hynix roadmaps.
18. **BESI – BE Semiconductor Industries (Netherlands)** –
* Advanced packaging specialist; **hybrid bonding tools** for 3D logic and HBM4 are considered industry-leading. ([Besi][16])
19. **Kulicke & Soffa (K&S, Singapore/USA)** –
* Historic leader in **wire bonding**; now expanding into **advanced packaging, hybrid bonding and system-in-package (SiP)**. ([KNS][17])
20. **Onto Innovation (USA)** –
* Provides **inspection, metrology, and packaging inspection systems**, plus yield-enhancing software; important in **advanced packaging & 3D integration**. ([OntoInnovation][18])
---
### Tier 4: Key niche & specialty equipment suppliers (21–30)
21. **Cohu (USA)** –
* 50+ years of expertise in **test handlers** and ATE, targeting SoC, RF, MEMS, and power devices. ([Cohu][19])
22. **EV Group – EVG (Austria)** –
* Leading provider of **wafer bonding, thin-wafer processing, and NIL lithography**; central to 3D-IC and heterogeneous integration flows. ([EV Group][20])
23. **SUSS MicroTec (Germany)** –
* Supplies equipment for **backend lithography, wafer bonding and photomask processing**, with strong presence in Europe, US, and Asia. ([SUSS][21])
24. **SEMES (South Korea)** –
* Samsung’s equipment arm; **Korea’s largest equipment manufacturer**, focusing on cleaning, photo-track, etch, and some back-end equipment. ([Semes][22])
25. **AMEC (China)** –
* Advanced etch and deposition vendor; cited as a key player in boosting China’s deposition market share alongside Naura. ([Infinity Market Research][4])
26. **Oxford Instruments Plasma Technology (UK)** –
* Provides **etch & deposition tools (RIE, ICP, ALD)** for compound semiconductors, RF, power devices, and R&D. ([Oxford Instruments][23])
27. **Plasma-Therm (USA)** –
* Specializes in **plasma etch, deposition, and plasma dicing** for specialty semiconductor and advanced packaging markets. ([Plasma-Therm][24])
28. **MKS Instruments (USA)** –
* Supplies **vacuum, RF power, gas delivery, optics and process control subsystems** for many front-end tools; crucial “sub-equipment” vendor. ([MKS][25])
29. **SMEE – Shanghai Micro Electronics Equipment (China)** –
* China’s main **lithography tool** producer (mature-node DUV steppers); strategically important for domestic fabs given export controls on ASML/US tools. ([Gii Korea][6])
30. **FormFactor (USA)** –
* World-class provider of **probe cards and wafer-level test hardware**, essential for DRAM, HBM, and advanced logic test. ([FormFactor, Inc.][26])
---
## 4. How the Equipment Market is Structured (English)
To understand these rankings, it helps to see the **major process segments**:
1. **Lithography (Patterning)**
* Core vendors: **ASML, Canon, Nikon, SMEE**, plus **EVG/SUSS** for NIL and back-end lithography. ([Gii Korea][6])
* EUV & High-NA: Only ASML at the leading edge.
2. **Etch & Deposition**
* Core vendors: **Applied Materials, Lam, TEL, Naura, AMEC, Oxford, Plasma-Therm, SEMES, ASM International**. ([Infinity Market Research][4])
* Critical for **GAA transistors, 3D NAND, power devices (SiC/GaN)**.
3. **Metrology & Inspection**
* Core vendors: **KLA, Hitachi High-Tech, SCREEN (some tools), Onto Innovation, ASML (actinic mask inspection), MKS (subsystems)**. ([Valuates Reports][27])
4. **Cleaning & Coater/Developer (Track)**
* Core vendors: **SCREEN, TEL, SEMES, Applied Materials**, etc. ([screen.co.jp][8])
5. **Test (ATE) & Handlers**
* Core vendors: **Advantest, Teradyne, Cohu, FormFactor**. ([株式会社アドバンテスト][9])
6. **Packaging & Advanced Packaging**
* Core vendors: **ASMPT, BESI, K&S, Hanmi, EVG, SUSS, Onto, Plasma-Therm, SEMES**. ([asmpt.com][11])
---
## 5. Practical Tips & “Applications” of this Ranking (English)
1. **For investment / strategy analysis**
* **Tier-1 (1–5)**: highly concentrated WFE core; cyclical but with strong long-term growth from AI, 2 nm and below, and HBM.
* **Tier-2 and Chinese vendors (6, 25, 29)**: fastest growth due to **localization and geopolitics**; Naura and AMEC are central to China’s etch/deposition roadmap. ([위키백과][7])
* **Packaging boom (11, 17–19, 22–23)**: driven by **chiplets, 2.5D/3D, HBM3/4** and AI data center demand. BESI, ASMPT, K&S, Hanmi, EVG and SUSS all sit in this trend. ([Harvard Business School][28])
2. **For technology tracking or R&D**
* To follow **EUV / High-NA**: watch **ASML, KLA, Hitachi High-Tech** and imec collaborations. ([hitachihyoron.com][29])
* For **hybrid bonding & HBM4 packaging**: **BESI, ASMPT, Hanmi, EVG, SUSS, Onto** plus Applied’s Kinex platform. ([Besi][16])
3. **For supply-chain / risk management**
* Many fabs depend on **single-source tools** (e.g., ASML EUV, BESI hybrid bonding, certain DISCO grinders), so any disruption directly impacts capacity. ([newsletter.semianalysis.com][30])
* **Subsystem vendors** like MKS and Oxford Instruments are hidden single-points-of-failure in vacuum, RF power, and etch subsystems. ([MKS][25])
4. **For content creation / education**
* You can map each **fab step** (lithography → etch → deposition → clean → metrology → test → packaging) to specific companies in the table and explain “who does what” in a chip factory, which is a good way to teach the semiconductor value chain in videos or articles.
---
## 6. 한국어 설명 (요약 + 활용)
### 6-1. 전세계 반도체 장비 시장 구조
* **1군(ASML, Applied, Lam, TEL, KLA)**
* 웨이퍼 전공정(WFE)의 핵심 5개사로, **노광(EUV/DUV), 식각, 증착, CMP, 검사·계측**을 사실상 과점하고 있습니다. ([IBS Electronics][1])
* **2군(Screen, ASM, Naura, Advantest, Teradyne 등)**
* 특정 공정(클리닝·코터/디벨로퍼, ALD, 테스트, 중국 국산화 장비 등)에 특화된 강자들입니다.
* **3군·4군(ASMPT, Hanmi, BESI, K&S, EVG, SUSS, SEMES, AMEC, Oxford, Plasma-Therm, MKS 등)**
* **패키징·HBM·칩렛·3D 적층, 시험·핸들러, 특수 공정(플라즈마, 복합반도체, 파워반도체)** 영역을 담당하는 회사들입니다.
### 6-2. 한국 관점에서 눈여겨볼 포인트
1. **국산 장비와의 연결고리**
* **Hanmi Semiconductor**는 TechInsights의 ‘세계 Top 10 반도체 장비사’ 고객만족도 조사에 유일하게 포함된 한국 업체로, **HBM·하이브리드 본딩·메모리 패키징**에서 글로벌 고객을 확보하고 있습니다. ([hanmisemi.com][15])
* **SEMES**는 삼성전자 장비 자회사로, 세정·포토트랙·에치 등에서 **국산화·내부 공급**을 담당하며 한국 생태계 안정성에 결정적입니다. ([Semes][22])
2. **중국 장비의 부상과 위험**
* **Naura, AMEC, SMEE**는 중국의 국산 장비 대표 기업으로, 에치·증착·노광 영역에서 점유율을 빠르게 키우고 있습니다. ([위키백과][7])
* 미국·네덜란드의 수출 규제로 인해 **첨단(5 nm 이하)에서는 여전히 ASML·미국 업체 의존**이 크지만, **성숙 공정·파워반도체·디스플레이** 쪽에서는 중국 장비의 존재감이 커지고 있습니다.
3. **AI·HBM 시대의 장비 포인트**
* AI 서버용 HBM3/4 및 2.5D·3D 패키징 수요로 인해
* **BESI, ASMPT, Hanmi, K&S, EVG, SUSS, Onto, Plasma-Therm** 등 패키징·본딩·백엔드 장비사는 장기 성장 스토리를 가지고 있습니다. ([Reuters][31])
* 전공정 측면에서는 **ASML(EUV, High-NA), Applied/Lam/TEL(식각·증착), KLA/Hitachi High-Tech(계측)**의 중요성이 더 커지고 있습니다.
4. **활용 아이디어 (콘텐츠·비즈니스)**
* 이 30개사를 **공정 단계별로 재정렬**하여 “한 칩이 만들어지는 여정”을 영상/글로 풀면, 반도체 입문자에게 매우 직관적인 설명이 됩니다.
* 투자·사업 관점에서는
* 사이클 상단/하단에 따라 **전공정 vs 후공정**의 실적 민감도가 다르고,
* **장비 국산화·수출 규제·AI 수요**라는 세 축이 각 회사에 어떤 영향을 주는지를 정리하면, 전략 분석 자료로도 쓸 수 있습니다.
---
## 7. 日本語による要約説明
### 7-1. 市場構造
* **トップ5 (ASML, Applied, Lam, TEL, KLA)** は
**リソグラフィ・エッチング・成膜・CMP・計測/検査** をほぼ寡占している「フロントエンド中核企業」です。 ([IBS Electronics][1])
* **Naura / AMEC / SMEE** などの中国系企業は、成熟ノードやパワーデバイス向けで急速にシェアを拡大しています。 ([위키백과][7])
* **Advantest / Teradyne / Cohu / FormFactor** はテスト・ハンドラ分野、
**ASMPT / BESI / K&S / Hanmi / EVG / SUSS** は先端パッケージング・HBM・3D実装分野のキープレーヤーです. ([株式会社アドバンテスト][9])
### 7-2. 技術トレンド
* **EUV / High-NA**：ASML と KLA・Hitachi High-Tech などの計測が必須。
* **HBM・3Dパッケージング**：BESI, ASMPT, Hanmi, K&S, EVG, SUSS, Onto などがハイブリッドボンディングやファンアウト技術で重要。 ([Reuters][31])
### 7-3. 活用のヒント
* 半導体教育では、この30社を **「リソグラフィ → エッチング → 成膜 → 洗浄・トラック → 計測 → テスト → パッケージング」** に並べ替え、「どの工程を誰が担当しているか」を示すと理解しやすくなります。
* サプライチェーン分析では、**ASML EUV や BESI ハイブリッドボンダ、DISCO ダイサなどの“単一供給”装置**がリスク要因になります。 ([Scribd][2])
---
## 8. 中文（简体）说明与应用
### 8-1. 产业结构简要说明
* **前端核心五巨头**：ASML、应用材料（Applied Materials）、Lam Research、东京电子（TEL）、KLA，主导了全球光刻、刻蚀、沉积、CMP 以及计量检测等关键设备市场。 ([IBS Electronics][1])
* **中国本土厂商**：
* **北方华创（Naura）** 已被研究机构评为全球第六大设备公司，在刻蚀、PVD/CVD、清洗方面快速追赶国际厂商。 ([위키백과][7])
* **AMEC、SMEE** 分别在刻蚀/沉积和光刻领域承担“国产替代”的角色。 ([Infinity Market Research][4])
* **封装与测试**：
* ASMPT、BESI、韩美半导体、K&S、EVG、SUSS、Onto Innovation、Cohu、FormFactor 等公司集中在 **先进封装、HBM、3D 封装、探针卡、Handler** 等后端领域。 ([asmpt.com][11])
### 8-2. AI / HBM 浪潮下的关注点
* **AI 训练+推理服务器** 带动 HBM3/4、Chiplet 和 2.5D/3D 封装需求：
* 上游前端受益：ASML（EUV）、Applied / Lam / TEL（刻蚀与沉积）、KLA / Hitachi High-Tech（计量与检测）等。 ([Scribd][2])
* 后端受益：BESI（混合集成键合）、ASMPT、韩美半导体、K&S、EVG、SUSS 等。 ([Besi][16])
### 8-3. 实际应用建议
* 做行业研究或写文章时，可以把这 30 家公司按 **工艺环节** 分成表格，对应到晶圆厂的每一道工序，这样读者能清楚看到“光刻机是谁的、刻蚀机是谁的、封装设备是谁的”。
* 风险管理层面，需要识别 **单一供应商设备**（如 ASML EUV、BESI 混合键合工具、DISCO 切割研磨设备等）对产能的影响。 ([Scribd][2])
---
## 9. 간단 용어 대조표 (EN / KO / JP / ZH)
| English | 한국어 | 日本語 | 中文(简体) |
| ------------------------------ | --------- | ----------- | ------ |
| Lithography | 노광, 리소그래피 | リソグラフィ | 光刻 |
| Etch | 식각 | エッチング | 刻蚀 |
| Deposition (CVD/PVD/ALD) | 증착 | 成膜 | 沉积 |
| Metrology & inspection | 계측·검사 | 計測・検査 | 计量与检测 |
| Front-end (WFE) | 전공정 | 前工程 | 前端工艺 |
| Back-end / packaging | 후공정·패키징 | 後工程・パッケージング | 后端/封装 |
| ATE (Automated Test Equipment) | 자동 테스트 장비 | 自動テスト装置 | 自动测试设备 |
---
### 마지막 한 줄 정리
* 상위 30개 반도체 장비사는 **노광·식각·증착·세정·계측·테스트·패키징** 전체 체인을 거의 다 장악하고 있으며,
* **ASML·Applied·Lam·TEL·KLA(전공정)**, **Naura/AMEC/SMEE(중국)**,
**ASMPT·BESI·Hanmi·K&S·EVG·SUSS(패키징)**,
**Advantest·Teradyne·Cohu·FormFactor(테스트)**
이라는 축으로 보면 전체 지형이 가장 잘 보입니다.
- [Reuters](https://www.reuters.com/markets/deals/applied-materials-buys-9-stake-advanced-packaging-firm-besi-2025-04-15/?utm_source=chatgpt.com)
- [Reuters](https://www.reuters.com/technology/advantest-raises-full-year-operating-profit-forecast-by-24-strong-ai-demand-2025-07-29/?utm_source=chatgpt.com)
- [Investopedia](https://www.investopedia.com/teradyne-stock-leads-s-and-p-500-gainers-after-better-than-expected-results-11781740?utm_source=chatgpt.com)
- [Times Union](https://www.timesunion.com/business/article/ualbany-chip-production-line-albany-nanotech-gets-20051426.php?utm_source=chatgpt.com)
[1]: https://www.ibselectronics.com/resources/news/top-10-semiconductor-equipment-manufacturers-in-the-world-in-terms-of-market-size-in-2024/ "Top 10 Semiconductor Equipment Manufacturers in the World in Terms of Market Size in 2024 | IBS Electronics"
[2]: https://www.scribd.com/document/901625793/Allianz-Trade-Semiconductors-Report-2025-En?utm_source=chatgpt.com "Allianz Trade Semiconductors Report 2025 en | PDF"
[3]: https://www.thebusinessresearchcompany.com/report/semiconductor-capital-equipment-global-market-report?utm_source=chatgpt.com "Semiconductor Capital Equipment Market Size Report 2025"
[4]: https://infinitymarketresearch.com/report/semiconductor-processing-equipment-market/38509?utm_source=chatgpt.com "Global Semiconductor Processing Equipment Market ..."
[5]: https://www.bccresearch.com/market-research/manufacturing/semiconductor-machinery-manufacturing-global-markets.html?srsltid=AfmBOopExv1TwSQ9_5pIvwJi57C6seupHhbsLZWVZz9A6KALNuPLs883&utm_source=chatgpt.com "Semiconductor Machinery Manufacturing: Global Markets"
[6]: https://www.giikorea.co.kr/report/qyr1693165-semiconductor-manufacturing-equipment-global.html?utm_source=chatgpt.com "시장 점유율과 순위, 전체 매출 및 수요 예측(2025-2031년)"
[7]: https://en.wikipedia.org/wiki/Naura_Technology?utm_source=chatgpt.com "Naura Technology"
[8]: https://www.screen.co.jp/spe/en/products?utm_source=chatgpt.com "Products | SCREEN Semiconductor Solutions Co., Ltd."
[9]: https://www.advantest.com/en/news/2025/20250522.html?utm_source=chatgpt.com "Advantest Ranks Global #1 in Assembly Test Equipment ..."
[10]: https://www.teradyne.com/automated-test-equipment/?utm_source=chatgpt.com "Automated Test Equipment"
[11]: https://www.asmpt.com/?utm_source=chatgpt.com "ASMPT - Enabling the digital world"
[12]: https://www.disco.co.jp/eg/products/?utm_source=chatgpt.com "Product Information"
[13]: https://www.accretech.com/en/product/semicon/semi/index.html?utm_source=chatgpt.com "Semiconductor Manufacturing Equipment"
[14]: https://www.hitachi-hightech.com/global/en/products/semiconductor-manufacturing/?utm_source=chatgpt.com "Semiconductor Manufacturing Equipment"
[15]: https://www.hanmisemi.com/index.php?CurrentPage=4&action=SiteBoardCn&iBrdContNo=11&iBrdNo=5&module=Board&sBrdContRe=0&sMode=VIEW_FORM&sSearchField=&sSearchValue=&utm_source=chatgpt.com "HANMI Semiconductor"
[16]: https://www.besi.com/products-technology/productgroup/hybrid-bonding/?utm_source=chatgpt.com "Hybrid Bonding"
[17]: https://www.kns.com/?utm_source=chatgpt.com "K&S - Leading Provider of Interconnect Solutions"
[18]: https://ontoinnovation.com/product-categories/metrology/?utm_source=chatgpt.com "Semiconductor Metrology Products"
[19]: https://www.cohu.com/test-handlers/?utm_source=chatgpt.com "Test Handlers"
[20]: https://www.evgroup.com/products/bonding?utm_source=chatgpt.com "Bonding"
[21]: https://www.suss.com/en?utm_source=chatgpt.com "SUSS Semiconductor Equipment Manufacturer"
[22]: https://semes.com/en/company/corporate-overview?utm_source=chatgpt.com "SEMES"
[23]: https://www.oxinst.com/products/deposition-and-etch-tools/?utm_source=chatgpt.com "Deposition & Etch Tools"
[24]: https://www.plasmatherm.com/?utm_source=chatgpt.com "Plasma-Therm Main"
[25]: https://www.mks.com/?utm_source=chatgpt.com "MKS Instruments"
[26]: https://www.formfactor.com/products/probe-cards/?utm_source=chatgpt.com "Probe Cards - Design and Manufacturing"
[27]: https://reports.valuates.com/market-reports/QYRE-Auto-17M2831/covid-19-impact-on-semiconductor-manufacturing-equipment?utm_source=chatgpt.com "Semiconductor Manufacturing Equipment Market Size"
[28]: https://www.hbs.edu/faculty/Pages/item.aspx?num=67656&utm_source=chatgpt.com "The Rise of Advanced Packaging: Kulicke & Soffa's ..."
[29]: https://www.hitachihyoron.com/rev/archive/2023/r2023_02/pdf/2023_02_11.pdf?utm_source=chatgpt.com "Semiconductor Device Manufacturing & Inspection Equipment"
[30]: https://newsletter.semianalysis.com/p/disco-corporation-the-world-leader?utm_source=chatgpt.com "DISCO Corporation, The World Leader In Semiconductor ..."
[31]: https://www.reuters.com/markets/deals/applied-materials-buys-9-stake-advanced-packaging-firm-besi-2025-04-15/?utm_source=chatgpt.com "Applied Materials becomes largest shareholder of advanced packaging firm BESI"